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ICs for Communications
MIXER PMB 2331 Version 1.2
Preliminary Data Sheet 02.96
T2331-XV12-P1-7600
PMB 2331 Revision History: Previous Version: Page (in Version) Page (in new Version)
Current Version: 02.96 none Subjects (major changes since last revision)
Edition 02.96 Published by Siemens AG, Bereich Halbleiter, MarketingKommunikation, Balanstrae 73, 81541 Munchen (c) Siemens AG 1996. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express written approval of the Semiconductor Group of Siemens AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
PMB 2331
Table of Contents 1 1.1 1.2 1.3 1.4 1.5 1.6 2 2.1 2.2 2.3 2.4 3
Page 4 4 4 5 5 6 7
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Applications: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Circuit Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Operational Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 AC/DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Semiconductor Group
3
02.96
MIXER
PMB 2331
Version 1.2 1 1.1 * * * * * * * * * * * * Overview Functional Description
Bipolar IC
New B6HF bipolar techology, 25 GHz fT Reduced external components Frequency range up to 2.0 GHz 2.7-4.5 V supply voltage Mixer current adjustable with external resistors 1.6mA current consumption typical (no external resistors used) - 40 C to + 85 C operational temperature range Gilbert cell mixer Very highly isolated RF, LO and IF ports Good crosstalk performance Low noise Low spurious signal content Applications:
P-DSO-8-1
1.2 * * * * *
Cellular radio mixer Cordless telephone mixer UHF transceiver RF data links RF/VHF/UHF frequency conversion
Type PMB 2331
Semiconductor Group
Ordering Code
Package P-DSO-8-1
4
02.96
PMB 2331
1.3
Pin Configuration (top view) P-DSO-8-1
Figure 1
1.4 Pin No. 1 2 3 4 5 6 7 8
Pin Definitions and Functions Symbol MO MOX Function Mixer signal output, open collector, not inverted Mixer signal output, open collector, inverted Mixer voltage supply Mixer local oscillator signal base input, inverted Mixer local oscillator signal base input, not inverted Mixer ground Mixer signal emitter input, not inverted Mixer signal emitter input, inverted
VS
LOX LO GND MI MIX
Semiconductor Group
5
02.96
PMB 2331
1.5
Functional Block Diagram
Figure 2
Semiconductor Group 6 02.96
PMB 2331
1.6
Circuit Description
The mixer used in this design is a general purpose up-/downconversion gilbert cell mixer. An amplified and filtered RF signal enters the IC via the pins MI/MIX. Using an external supplied local oscillator at LO/LOX a converted output signal is created at the open collector output pins MO/MOX, which have to be connected to an external voltage supply. The RF connections to the mixer inputs may be single ended or balanced, capacitive or inductive coupled. Voltage supply for the mixer has to be connected to the pins VS and GND. To increase the mixer current resistors need to be connected between the pins MI and GND, and between the pins MIX and GND. Differential signals and symmetrical circuits are used throughout the IC. An internal bias driver generates supply voltage and temperature compensated reference voltages. All pins with the exception of GND are ESD protected.
Semiconductor Group
7
02.96
PMB 2331
2 2.1 # 1 2a 2b 3 4 5 6 7
Electrical Characteristics Absolute Maximum Ratings TA = - 40 C to + 85 C Parameter Supply voltage Input voltage MI/MIX Input voltage LO/LOX Open collector output voltage Differential input voltage Junction temperature Storage temperature Thermal resistance Symbol Limit Values min. max. 5.5 1.9 V V V V - 0.3 - 0.3 0.6 1.3 Unit Remarks
VS VMI/MIX VLO/LOX VMO/MOX VDIFF Tj TS RthJA
VS = 0 V
VS + 0.3 VS + 0.3
2.0 125
VPP
C C K/W
- 40
125 185
Note: Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit.
2.2 Operational Range
Within the operational range the IC operates as described in the circuit description. The AC/DC characteristic limits are not guaranteed.
VVCC = 2.7 V...4.5 V, TA = - 40 C to 85 C
# 1 2 3 Parameter MI/X Input Frequency LO/X Input Frequency IF Intermediate Frequency Symbol Limit Values min. max. 2000 2000 2000 MHz MHz MHz Unit Remarks
fMI fLO fIF
Note: Power levels refer to 50 impedance. In the operating range the functions given in the circuit description are fulfilled.
Semiconductor Group
8
02.96
PMB 2331
2.3
#
AC/DC Characteristics VVCC = 2.7 V to 4.5V, TA = 25 C
Parameter Symbol Limit Values min. typ. max. Unit Test Condition Test Circuit
Supply Current 1 2 Supply current, total IC Supply current, total IC
I1,2,3 I1,2,3
1.6 4.6
mA mA
without external 1a,b resistors R1,2 including external resistors R1,2 1)(=180 ) 1a,b
MIXER, Signal Input MI/MIX, Down Conversion, R1,2 = 180 3 4 Input impedance Max. input level, 1 db comp. at MO/MOX, IF = 45 MHz
S11M PMI
Diagram 2a - 16 dBm
f = 0.9 GHz f = 0.9 GHz f = 0.9 GHz f = 0.9 GHz 2)
1a
5 6 7
Input intercept point, IICP3MI f = 800 kHz, IF = 45 MHz
-2 - 16 9.5
dBm dBm dB
1a 1a 1a
PBL Blocking level f = 800 kHz, IF = 45 MHz
Noise figure, ssb, (NFSSB NFdsb + 3 dB) IF = 45 MHz
FMI
MIXER, Local Oscillator Input LO/LOX 8 9 Input impedance Input level
S11LO PLO
Diagram 2b -3 dBm
f = 0.9 GHz 3)
1a,b
Notes see page 10.
Semiconductor Group
9
02.96
PMB 2331
2.3
#
AC/DC Characteristics (cont'd) VVCC = 2.7 V to 4.5V, TA = 25 C
Parameter Symbol Limit Values min. typ. max. Unit Test Condition Test Circuit
MIXER, Signal Output MO/MOX, Down Conversion, R1,2 = 180 10 Output current
IMO+
MOX
4.0
mA
including 1a,b external resistors R1, R2 IF = 45 MHz IF = 300 MHz IF = 45 MHz IF = 300 MHz 1a 1b 1a 1b 1a 1b
11 12 13 14 15 16
Output resistance Output resistance Output capacitance Output capacitance Power gain, IF = 45 MHz
RMODiff
RMODiff
38 24 0.34 0.38 14 7
k k pF pF dB dB
CMODiff CMODiff PMI
f = 0.9 GHz f = 0.9 GHz
Power gain, IF = 300 MHz PMI
MIXER, Isolation Between In-/Output, 0.9 GHz 17 18 19 20 21
1) 2) 3)
MI to MO LO to MO LO to MI MO to MI MO to LO
AMI-MO ALO-MO ALO-MI AMO-MI AMO-LO
30 50 50 50 60
dB dB dB dB dB
fMI = 945 MHz fLO = 900 MHz
" " " "
1a 1a 1a 1a 1a
Minimum value for R41 = R2 = 33 . Matching network used. Referenced for specified mixer performance.
Note: The listed characteristics are ensured over the operating range of the integrated circuit. Typical characteristics specify mean values expected over the production spread. If not otherwise specified, typical characteristics apply at TA = 25 C and the given supply voltage.
Semiconductor Group
10
02.96
PMB 2331
2.4
Test Circuits
Figure 3 Test Circuit 1a
Test Circuit for 45 MHz Intermediate Frequency Test Circuit 1a
fIF [MHz]
45
CB [pF]
15 p/100 p
CK [pF]
15 p
X X
Semiconductor Group
11
02.96
PMB 2331
Figure 4 Test Circuit 1b
Test Circuit for 300 MHz Intermediate Frequency Test Circuit 1b
fIF[MHz]
300
L0[nH] 680
L1[nH] 150
C1[pF] 2.7
C2[pF] 12
C3[pF] 1.8
CK[pF] 15p
Semiconductor Group
12
02.96
PMB 2331
Figure 5 Test Circuit 2 S-Parameter Measurement of Mixer S11, S12, S21, S2
Test LO-Input impedance Mi-Input impedance MO-Output impedance
Test Frequency [GHz] .. - 3.0 .. - 3.0 .. - 3.0
Pin X 4 7 1
Pin Y 5 8 2
The S-Parameters are tested at the indicated frequency and the equivalent parallel or series circuit is calculated on this base. Via the NWA the capacitive coupling is done and the open collector pins are connected to VCC. The output levels at port1 and 2 for pin x and y are - 30 dbm for MI and MOimpedances and - 5 dbm for the LO impedance. S-Parameters have to be considered as design hints and are measured with SIEMENS testboards (RT/Duroid 5880 Teflon, = 2.2).
Semiconductor Group
13
02.96
PMB 2331
Figure 6 Test Circuit 2a Mixer Input Impedance Measurement
Figure 7 Test Circuit 2b Mixer Local Oscilllator Impedance Measurement
Semiconductor Group 14 02.96
PMB 2331
Figure 8 Test Circuit 2c Mixer Output Impedance Measurement
Semiconductor Group
15
02.96
PMB 2331
Electrical Characteristics Diagram 2a S-Parameter Mixer Input MI Impedance, IMO/MOX = 4 mA; f = .. 3 GHz
Semiconductor Group
16
PMB 2331
Electrical Characteristics Diagram 2b S-Parameter Mixer Input LO Impedance, IMO/MOX = 4 mA; f = .. 3 GHz
Semiconductor Group
17
PMB 2331
Application Circuit Application circuit: In evaluation General applications also refer to the PMB 2330 application note (different values)
Semiconductor Group
18
02.96
PMB 2331
3
Package Outlines P-DSO-8-1 (Plastic Dual Small Outline Package)
Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book "Package Information". SMD = Surface Mounted Device Semiconductor Group 19
Dimensions in mm 02.96
GPS05121
PMB 2331
Semiconductor Group
20
02.96
PMB 2331
Semiconductor Group
21
02.96

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